Thermal Grease
A non-curing compound and the preferred thermal material for thin bond lines.
TCP Series Thermal Grease
Zhenmorntek thermal grease achieves the ideal combination of high thermal conductivity and low thermal resistance, along with low viscosity and excellent thixotropy, ensuring good interfacial wetting and meeting the demands of a wide range of operating conditions.
Standard Products
| Thermal Grease |
TCP 01510 |
TCP 02030 |
TCP 02530 |
TCP 03010 |
TCP 03010LR |
TCP 03510 |
TCP 04010 |
TCP 05020 |
Test Method |
| Basic Properties |
| Color |
White |
Blue |
Blue |
White |
White |
White |
White |
Gray |
Visual |
| Density (g/cm³) |
2.8 |
3 |
3.1 |
3.2 |
3.2 |
3.2 |
3.4 |
3.5 |
ASTM D792 |
| Viscosity (cps) |
67,500 |
87,500 |
100,000 |
125,000 |
200,000 |
150,000 |
150,000 |
150,000 |
ASTM D2196 |
| Recommended Operating Temperature (°C) |
-50~+150 |
-50~+150 |
-50~+150 |
-50~+150 |
-50~+150 |
-50~+150 |
-50~+150 |
-50~+150 |
ASTM D2196 |
| Volatile Content, 200 °C × 24 h |
＜0.5 |
＜0.5 |
＜0.5 |
＜0.5 |
＜0.5 |
＜0.5 |
＜0.5 |
＜0.5 |
ASTM E595 |
| Minimum Bond Line Thickness (µm) |
25 |
25 |
25 |
20 |
10 |
20 |
40 |
40 |
ASTM D5470 |
| Thermal Properties |
| Thermal Conductivity (W/m·K) |
1.5 |
2.0 |
2.5 |
3.0 |
2.5 |
3.5 |
4.0 |
5.0 |
ASTM D5470 |
| Thermal Resistance @50 psi (°C·cm²/W) |
0.2 |
0.18 |
0.16 |
0.15 |
0.08 |
0.12 |
0.15 |
0.15 |
ASTM D5470 |
| Electrical Properties |
| Dielectric Strength (kV/mm) |
＞10 |
＞10 |
＞10 |
＞10 |
＞10 |
＞10 |
＞10 |
＞10 |
ASTM D149 |
| Relative Permittivity @1 MHz |
＞5 |
＞5 |
＞5 |
＞5 |
＞5 |
＞5 |
＞5 |
＞5 |
ASTM D257 |
| Volume Resistivity (ohm·cm) |
＞1.0×10¹³ |
＞1.0×10¹³ |
＞1.0×10¹³ |
＞1.0×10¹³ |
＞1.0×10¹³ |
＞1.0×10¹³ |
＞1.0×10¹³ |
＞1.0×10¹³ |
ASTM D150 |
| Flame Retardancy |
| Flame Rating |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
UL 94 |
Custom Development
HP Low Thermal Resistance Series
- An innovative formulation delivers ultra-low thermal resistance and pushes back the limits of heat dissipation
- The ideal balance between high thermal conductivity and low thermal resistance
- Highly reliable in the long term, with performance that does not degrade
| HP Series Thermal Grease |
TCP 03010HP |
TCP 04010HP |
TCP 05020HP |
| Color |
White |
White |
Off-white |
| Thermal Conductivity (W/m·K) |
3.0 |
4.0 |
5.0 |
| Thermal Resistance (°C·cm²/W), 50 psi |
0.05 |
0.05 |
0.05 |
| Minimum Bond Line Thickness (µm) |
10 |
20 |
20 |
| Recommended Operating Temperature (°C) |
-50~150 |
-50~150 |
-50~150 |
HT High Temperature Series
- Pushes back temperature limits, with no drying out during long-term use at 250 °C
- Low oil bleed at high temperature for sustained low thermal resistance and efficient cooling
- Offers more options for high-temperature applications such as ceramic heating elements, 3D printer hot ends and high-power IGBTs
| HT Series Thermal Grease |
TCP 02010HT |
TCP 03010HT |
| Color |
White |
White |
| Thermal Conductivity (W/m·K) |
2.0 |
3.0 |
| Thermal Resistance (°C·cm²/W), 50 psi |
0.13 |
0.11 |
| Minimum Bond Line Thickness (µm) |
10 |
20 |
| Recommended Operating Temperature (°C) |
-50~250 |
-50~250 |
SF Silicone-Free Series
- Purely silicone-oil free, with zero silicone volatilization and zero silicone migration
- Completely eliminates the risk of silicone contamination in optical and precision electronic components
- Formulated with a high-flash-point non-silicone base oil for stable, reliable performance
| SF Series Thermal Grease |
TCP 01510SF |
TCP 02510SF |
TCP 03510SF |
| Color |
White |
White |
White |
| Thermal Conductivity (W/m·K) |
1.5 |
2.5 |
3.5 |
| Thermal Resistance (°C·cm²/W), 50 psi |
0.20 |
0.15 |
0.10 |
| Minimum Bond Line Thickness (µm) |
10 |
10 |
20 |
| Recommended Operating Temperature (°C) |
-50~125 |
-50~125 |
-50~125 |
Storage and Use
- Store at normal temperature and humidity
- Shelf life: 12 months
Packaging
- Syringe: 15 CC, 30 CC
- Pail: 1 kg, 5 kg, 20 kg
