Enabling smarter living.
Consumer electronics are highly sensitive to cost and process efficiency, and the pursuit of attractive, slim designs has greatly reduced the space available for heat dissipation inside devices. This places new performance demands on thermal interface materials: high compressibility, low stress, and easy dispensing and rework.
| Color | White |
|---|---|
| Thermal Conductivity (W/m·K) | 3.5 |
| Viscosity (mPa·s) | 100,000 |
| Recommended Operating Temperature (°C) | -50~150 |
| Flame Rating | V-0 |
| Color | White |
|---|---|
| Thermal Conductivity (W/m·K) | 4.0 |
| Thermal Resistance (°C·cm²/W), 50 psi | 0.05 |
| Minimum Bond Line Thickness (µm) | 25 |
| Recommended Operating Temperature (°C) | -50~150 |
| Color | Pink |
|---|---|
| Thermal Conductivity (W/m·K) | 5.0 |
| Minimum Bond Line Thickness (µm) | 125 |
| Recommended Operating Temperature (°C) | -50~150 |
| Flame Rating | V-0 |
Our products are designed for long-term use in industrial applications, and every product is validated for long-term reliability.
Beyond our proven standard series, we can develop products better suited to your operating conditions, with support for small-batch trials.
We put years of expertise into research, development and production to create solutions you can always rely on.
Address:Building 5, Lvmai Zhigu, 2082 Huifeng West Road, Fengxian District, Shanghai
Email:info@zhenmorntek.com