General Industry
Custom material solutions for smarter industry.
More Cost-Effective Thermal Interface Materials for Electronic Components in Industrial Applications
As industrial intelligence spreads, electronic components inside all kinds of equipment run under sustained heavy load, and heat dissipation has become a key constraint on stable operation. Zhenmorntek provides customized material solutions.
Industrial Applications
TCP 03010HT
High-Temperature Thermal Grease
- Pushes back temperature limits, with no drying out during long-term use at 250 °C
- Low oil bleed at high temperature for sustained low thermal resistance
- Keeps IGBT modules running reliably over the long term
| Color |
White |
| Thermal Conductivity (W/m·K) |
3.0 |
| Thermal Resistance (°C·cm²/W), 50 psi |
0.11 |
| Minimum Bond Line Thickness (µm) |
20 |
| Recommended Operating Temperature (°C) |
-50~250 |
TCP 03010HP
Low-Thermal-Resistance Thermal Grease
- An innovative formulation achieves ultra-low thermal resistance and pushes back performance limits
- An ideal balance of high thermal conductivity and thermal resistance
- High reliability
| Color |
White |
| Thermal Conductivity (W/m·K) |
3.0 |
| Thermal Resistance (°C·cm²/W), 50 psi |
0.05 |
| Minimum Bond Line Thickness (µm) |
10 |
| Recommended Operating Temperature (°C) |
-50~150 |
TCP 01510SF
Silicone-Free Thermal Grease
- Purely silicone-oil free, with zero silicone volatilization and zero silicone migration
- Completely eliminates the risk of silicone contamination in optical and precision electronic components
- Formulated with a high-flash-point non-silicone base oil for stable, reliable performance
| Color |
White |
| Thermal Conductivity (W/m·K) |
1.5 |
| Thermal Resistance (°C·cm²/W), 50 psi |
0.20 |
| Minimum Bond Line Thickness (µm) |
10 |
| Recommended Operating Temperature (°C) |
-50~125 |
TCP 03010HT
High-Temperature Thermal Grease
- Temperature limits pushed back through a high-boiling-point, low-volatility synthetic base oil that supports continuous operation at 250 °C
- Thermal efficiency assured, delivering a stable 3 W/m·K thermal conductivity with no compromise at high temperature
- Broader application scope, offering more options for high-temperature scenarios such as ceramic heating elements and high-power IGBTs
| Color |
White |
| Thermal Conductivity (W/m·K) |
3.0 |
| Thermal Resistance (°C·cm²/W), 40 psi |
0.12 |
| Minimum Bond Line Thickness (µm) |
20 |
| Recommended Operating Temperature (°C) |
-50~250 |
TPE 02510LV
Thermal Encapsulants and Potting Materials for Micro Inverters
- Ultra-low volatility that eliminates siloxane contamination
- Excellent thermal performance and a low coefficient of expansion
- Reliable protection for precision circuits
| Color |
White |
| Thermal Conductivity (W/m·K) |
2.5 |
| Viscosity (cps) |
10,000 |
| Recommended Operating Temperature (°C) |
-50~175 |
| Flame Rating |
V-0 |
Our Strengths
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Reliable in the Long Term
Our products are designed for long-term use in industrial applications, and every product is validated for long-term reliability.
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Customized Solutions
Beyond our proven standard series, we can develop products better suited to your operating conditions, with support for small-batch trials.
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Trusted Expertise
We put years of expertise into research, development and production to create solutions you can always rely on.