Enabling an intelligent, fully connected world.
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As communications technology advances, chip modules with higher power density and greater integration are entering service faster, placing greater demands on thermal management. Zhenmorntek has introduced a series of thermal management solutions designed for modern base stations.
| Color | White |
|---|---|
| Thermal Conductivity (W/m·K) | 3.0 |
| Thermal Resistance (°C·cm²/W), 50 psi | 0.05 |
| Minimum Bond Line Thickness (µm) | 10 |
| Recommended Operating Temperature (°C) | -50~150 |
| Color | Blue |
|---|---|
| Thermal Conductivity (W/m·K) | 6.0 |
| Minimum Bond Line Thickness (µm) | 125 |
| Recommended Operating Temperature (°C) | -50~150 |
| Flame Rating | V-0 |
| Color | Blue |
|---|---|
| Thermal Conductivity (W/m·K) | 8.0 |
| Minimum Bond Line Thickness (µm) | 150 |
| Recommended Operating Temperature (°C) | -50~150 |
| Flame Rating | V-0 |
Our products are designed for long-term use in industrial applications, and every product is validated for long-term reliability.
Beyond our proven standard series, we can develop products better suited to your operating conditions, with support for small-batch trials.
We put years of expertise into research, development and production to create solutions you can always rely on.
Address:Building 5, Lvmai Zhigu, 2082 Huifeng West Road, Fengxian District, Shanghai
Email:info@zhenmorntek.com