Advanced materials for a digital future.
The rapid growth of data services such as cloud computing and cryptocurrency mining has significantly increased data center loads, making effective thermal management essential. Zhenmorntek has introduced advanced thermal interface materials with low thermal resistance and high thermal conductivity, precisely addressing the cooling challenges of high-density computing and supporting improvements in energy efficiency.
| Color | Blue |
|---|---|
| Thermal Conductivity (W/m·K) | 12.5 |
| Minimum Bond Line Thickness (µm) | 200 |
| Recommended Operating Temperature (°C) | -50~150 |
| Flame Rating | V-0 |
| Color | Off-white |
|---|---|
| Thermal Conductivity (W/m·K) | 5.0 |
| Thermal Resistance (°C·cm²/W), 50 psi | 0.05 |
| Minimum Bond Line Thickness (µm) | 25 |
| Recommended Operating Temperature (°C) | V-0 |
| Color | Blue |
|---|---|
| Thermal Conductivity (W/m·K) | 7.5 |
| Minimum Bond Line Thickness (µm) | 50 |
| Recommended Operating Temperature (°C) | -50~150 |
| Flame Rating | V-0 |
Our products are designed for long-term use in industrial applications, and every product is validated for long-term reliability.
Beyond our proven standard series, we can develop products better suited to your operating conditions, with support for small-batch trials.
We put years of expertise into research, development and production to create solutions you can always rely on.
Address:Building 5, Lvmai Zhigu, 2082 Huifeng West Road, Fengxian District, Shanghai
Email:info@zhenmorntek.com